8th International Congress on Thermal Stresses 2009

Aim of the Congress

The objective of the Congress are to provide a forum for scientists and engineers from academia, research laboratories, and industry from all over the world who are involved in the field of thermal stresses to exchange ideas and to extend further cooperation among participants. The Congress should forge cooperative links between researchers and engineers by bringing them to one place, where they present their achievements and conduct discussions.
Scope:

* Thermal Stresses and Deformations
* Thermoelasticity and Viscoelasticity
* Thermal Stresses in:
o Contact Mechanics
o Dynamic Problems
o Fracture and Fatigue Heterogeneous
Materials
o Manufacturing
* Thermo-Biomechanics
* Thermal Shock
* Continuum Thermomechanics
* Heat Conduction and Radiation Problems
* Experimental Methods in Thermal Stresses
* Computational Methods in Thermal Stresses
* Control of Thermal Structures
* Instability and Localization under Thermomechanical Loading
* Inverse and Optimization Methods in Thermomechanics

Time and Place

The Congress will be held June 1-4, 2009, on the campus of the University of Illinois at Urbana-Champaign

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